Contract - Senior Principal Electronics Engineer - Digital

  • Job Reference: SPE22
  • Date Posted: 25 March 2024
  • Recruiter: Wireless Mobile International Search
  • Location: Cambridge Area
  • Salary: On Application
  • Bonus/Benefits: Competitive Benefits Package
  • Sector: Design Engineering, Hardware Engineering, Test Engineering
  • Job Type: Contract
  • Duration: Permanent
  • Work Hours: Full Time
  • Contact: Graham Quinn
  • Email: graham@wirelessmobilesearch.com

Job Description

My client is looking to recruit an enthusiastic and highly motivated Senior Principal Electronics Engineer, specializing in high-speed digital design to join the R&D team to work on new LTE mobile devices and solutions up to 31st August 2024.

 The Role:

As Senior Principal Electronics Engineer, you’ll be involved in the whole lifecycle of product development from concept and prototype stages, through to production and support.

As well as having demonstrable experience of leading and owning the design of electronic systems, you should have:

  • A strong background in electronics design from initial concept, specification through to software and systems integration, test, and manufacture.
  • You should have experience in high speed digital circuit and component level design as well as interfaces such as USB3, MIPI & PCI.
  • Strong problem-solving and communication skills
  • The ability to deliver against tight deadlines
  • A conscientious, enthusiastic and reliable attitude, taking pride in your work
  • Self-driven and motivated to use your own initiative and take a technical lead as well as work to a high level of quality with good attention to detail.
  • A willingness to continually learn

 

You will be supported by your manager and team, as well as collaborating with other departments across the business and activities you will be responsible for include:-

  • Requirements analysis and understanding including liaison with stakeholders
  • Technical design and specification of digital and analogue circuitry for radio and accessory products
  • Complete subsystem design and implementation, including subsystem ownership.
  • Integration with RF, Audio and MMI subsystems.
  • Component specification and sourcing
  • Design, integration and test documentation
  • Definition, implementation and supervision of PCB layout rules and constraints
  • Resolution of design and integration issues
  • Interaction with the SW team at device driver level (especially during bring-up phases)
  • Type approval support
  • Production technical support including sub system test strategy.
  • Technical support to end customers

If you think you’ve got what it takes to be successful, please click on ‘apply now’ and send me your CV.